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In industrial use, hot melt adhesives provide several advantages over solvent-based adhesives. Volatile organic compounds are reduced or eliminated, and the drying or curing step is eliminated.
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In industrial use, hot melt adhesives provide several advantages over solvent-based adhesives. Volatile organic compounds are reduced or eliminated, and the drying or curing step is eliminated. Excellent operability and easy processing characteristics meet the requirements of various industries, such as woodworking, construction, textile, footwear and automotive industries. We also develop customized polyurethane hot melt adhesive, pur hot melt glue special specifications.Hot melt adhesives have a long shelf life and usually can be disposed of without special precautions. Some of the disadvantages involve thermal load of the substrate, limiting use to substrates not sensitive to higher temperatures, and loss of bond strength at higher temperatures, up to complete melting of the adhesive. Loss of bond strength can be reduced by using a reactive adhesive that after solidifying undergoes further curing, whether by moisture , or ultraviolet radiation. Some HMAs may not be resistant to chemical attacks and weathering. HMAs do not lose thickness during solidifying, whereas solvent-based adhesives may lose up to 50–70% of layer thickness during drying.
In industrial use, hot melt adhesives provide several advantages over solvent-based adhesives. Volatile organic compounds are reduced or eliminated, and the drying or curing step is eliminated. Excellent operability and easy processing characteristics meet the requirements of various industries, such as woodworking, construction, textile, footwear and automotive industries. We also develop customized polyurethane hot melt adhesive, pur hot melt glue special specifications.Hot melt adhesives have a long shelf life and usually can be disposed of without special precautions. Some of the disadvantages involve thermal load of the substrate, limiting use to substrates not sensitive to higher temperatures, and loss of bond strength at higher temperatures, up to complete melting of the adhesive. Loss of bond strength can be reduced by using a reactive adhesive that after solidifying undergoes further curing, whether by moisture , or ultraviolet radiation. Some HMAs may not be resistant to chemical attacks and weathering. HMAs do not lose thickness during solidifying, whereas solvent-based adhesives may lose up to 50–70% of layer thickness during drying.
